
NXP Semiconductors
PESD3V3X1BL
Ultra low capacitance bidirectional ESD protection diode
11. Soldering
1.3
0.7
R0.05 (8 × )
solder lands
0.9
0.3
(2 × )
0.6 0.7
(2 × ) (2 × )
solder resist
solder paste
occupied area
Dimensions in mm
0.4
(2 × )
sod882_fr
Re?ow soldering is the only recommended soldering method.
PESD3V3X1BL_1
Fig 7.
Re?ow soldering footprint PESD3V3X1BL (SOD882)
? NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 01 — 6 January 2009
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